product description

product overview

Laser micro hole processing is the process of creating a series of small through holes in packaging materials, creating channels that are easy to tear, and regulating moisture inside the packaging bag. Laser micro hole processing can make thicker and stronger packaging materials easy to achieve while maintaining their structural strengthOpen it. Micro porous processing can also be used in various packaging products to control air flow and moisture release, achieving the purpose of preservation. This technology has broad prospects and can increase the shelf life of fresh products or simply release air from packaging. Usually, laser firingThe advantage of a hole is that the focused laser spot evaporates a small hole at a determined point in the material, rather than piercing or tearing the material like mechanical drilling. Therefore, laser drilling produces more uniform small holes than other processing methods.

The complete set of laser drilling equipment for preservative packaging bags launched by Wuhan Dazu Jinshikai Laser System Co., Ltd. is particularly suitable forPET/ PE/Laser micro hole processing of paper composite anti-corrosion and preservation agent packaging. This product has completely independent intellectual property rights and has reached the international advanced level in technology. Short production cycle, stable performance, all day long24Working continuously for hours, with a lifespan of10Years or more.

Application scope

Fresh packaging (MAP), freshly picked agricultural products, sliced fruits, vegetables, salty snacks, sliced meat products, semi processed grilled foods, freshly cooked foods, frozen foods, microwave food, pet food, bird food, fertilizers, cement, grassSeed, salt/Melting ice

Product Features

ØThe operator can automatically control the size, quantity, position, and spacing of the holes from the laser system software

ØCapable of processing circular and elliptical holes, and can simultaneously perform multiple drilling processes

ØThe laser beam used as a tool does not have actual contact with the material

ØThe diameter of the focal point drilled on the material（0.05～0.15Millimeters)

ØThroughout the entire process of accelerating and decelerating the machine, the processed products are qualified

ØHigh utilization efficiency of laser power and wide range of materials that can be processed

ØClear micro hole processing, heat sealing the edges of the holes to make them more secure. There is no leftover material on the film

ØIncrease shelf life – Micro pores can help air flow and release moisture, keeping the product fresh

ØEasy to fill/No overflow – During infusion, air can quickly overflow. Micro pores can allow air to escape while retaining the product

ØThe packaging bag is more compact and easy to stack

performance index

Product model: D200P-1500P (optional))

Laser power: 200W-1500W

Spectral splitting method: Prism splitting

Number of laser heads: 48、12optional

Prism rotation speed: 40000

Number of prism faces: 2436、48optional

Hole spacing: 1-5mm (touch screen setting parameters))

Maximum punching speed: 4.6 million pieces/divide

Maximum linear speed: 450 meters/minute

Monthly production: 18-25 tons

Indicator setting method: independent, simple

Processing tray paper: Φ520mm(Maximum)

Paper width range: 48-78mm

Flatness of the disk surface: ±0.3

Optical component replacement cycle:＞3year

Whole machine lifespan:＞10year